Tsaya thinner (FD-150A, FD-200A, FD-320A, FD550A wafer thinner)

Babban amfani:
Wannan na'urar ne yafi amfani da high-gudun daidaitaccen sassa na wuya m m kayan da ba na karfe da karfe kamar sapphire substrate, silicon zane, yumbu zane, gani gilashi, quartz lu'ulu'u, sauran semiconductor kayan.
Main siffofin tsaye reducer:

1, suction kwamfuta bisa ga abokin ciniki aiki bukatun za a iya raba zuwa lantarki magnetic suction kwamfuta da inji suction kwamfuta, suction kwamfuta size za a iya tsara bisa ga abokin ciniki bukatun, da diamita 320-600mm..
2, grinding ƙafafun spindle ya yi amfani da daidaito high-gudun juyawa lantarki spindle, da tuki hanyar ne mai juyawa mita daidaitawa gudun juyawa zai iya daidaitawa bisa ga daban-daban tsari bukatun tuki yanayin da PLC sarrafa tsarin goyon baya da kuma daidai canza gudun juyawa 3000-8000 juyawa daidaitawa.
3, grinding ƙafafun ciyar yanayin a cikin uku sassa saiti, zai iya mafi sauki saita ingantaccen thinning shirye-shirye, inganta daidaito da surface sakamako bayan thinning,
4, hanyar wuka ba tare da canza ƙafafun gila da kuma suction disk, don daban-daban kauri workpieces bukatar kawai sau daya a wuka zai iya ci gaba da aiki, ba bukatar kowane lokaci a wuka.
5, da injin ya yi amfani da high daidaito alama da kuma rail jagora bangarori, tuki hanya ne servo tuki, za a iya daidai canza alama juyawa gudun bisa ga daban-daban kayan aiki da kuma aiki bukatun da PLC sarrafa tuki yanayin, watau, kayan aiki daban-daban daban daban-daban daban daban-daban daban-daban daban-daban daban-daban daban-daban daban-daban daban-daban daban-daban daban-daban daban-daban daban
6, na'urar ta yi amfani da ci gaba Taiwan alama PLC da kuma taɓa allon, high madadin sarrafa kansa, cimma mutum-inji tattaunawa, aiki mai sauki da kuma bayyane.

7, kayan aiki na iya gano kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin kayan aikin Hakanan, daidaito da matakin jirgin sama za a iya sarrafawa a cikin ± 0.002mm kewayon.
2. High daidaitawa inganci, LED sapphire substrate iya daidaitawa har zuwa 48 microns a kowace minti gila gudun. Silicon wafa a kowace minti gila gudun iya rage har zuwa 250 microns.
Main fasaha sigogi:

Na'urar Slimming Tasirin Chart: